TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 1 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? applications 16-pin 3x3 qfn package ? repeaters ? mobile infrastructure ? lte / wcdma ? general purpose wireless product features functional block diagram ? 50-4000 mhz ? 15.3 db gain @ 1.9 ghz ? 0.8 db noise figure @ 1.9 ghz ? <1.5:1 i/o vswr ( >14 db i/o return loss) ? +34 dbm output ip3 ? +22.3 dbm p1db ? 50 ohm cascadable gain block ? unconditionally stable ? high input power capability ? single supply, 50 ma current general description pin configuration the TQP3M9005 is a high linearity low noise gain block amplifier in a low-cost surface-mount package. at 1.9 ghz, the amplifier typically provides 15.3 db gain, +34 dbm oip3, and 0.8 db noise figure while only drawing 50 ma current. the device is housed in a leadfree/green/rohs-compliant industry-standard 16-pin 3x3mm qfn package. the TQP3M9005 has the benefit of having high linearity while also providing very low noise across a broad range of frequencies. this allows the device to be used in both receive and transmit chai ns for high performance systems. the amplifier is internally matched using a high performance e-phemt process and only requires an external rf choke and bloc king/bypass capacitors for operation from a single supply. the internal active bias circuit also enables stable operation over bias and temperature variations. the TQP3M9005 covers the 0.05 - 4 ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. pin # symbol 2 rf input 11 rf output / vdd all other pins n/c or gnd backside paddle gnd ordering information part no. description TQP3M9005 lna gain block TQP3M9005-pcb 0.5-4 ghz evaluation board standard t/r size = 2500 pieces on a 7? reel. www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 2 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? specifications absolute maximum ratings parameter rating storage temperature -55 to 150 o c rf input power,cw,50 ? ,t=25oc 20 dbm device voltage,vdd +7 v operation of this device outsi de the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max unit s vdd 3 5 5.25 v tcase -40 +85 o c tch (for>10 6 hours mttf ) 190 o c electrical specifi cations are measured at sp ecified test conditions. specifications are not guarantee d over all recommended operating conditions. electrical specifications test conditions unl ess otherwise noted: +25oc, +5v, 50 ? system. parameter conditions min typical max units operational frequency range 50 4000 mhz test frequency 1900 mhz gain 13.9 15.3 16.9 db input return loss 12 db output return loss 14 db output p1db +22.3 dbm output ip3 see note 1. +30 +34 dbm noise figure 0.8 db supply voltage, vdd +5 v current, idd 35 50 68 ma thermal resistance (j unction to case) jc 76.8 o c/w n otes: 1. oip3 is measured with two tones at an output power of +2 dbm / tone separated by 1 mhz. th e suppression on the largest im3 pro duct is used to calculate the oip3 using 2:1 rule. 2:1 rule gives relative value with re spect to fundamental tone. www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 3 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? device characterization data 5 10 15 20 25 30 0.00.51.01.52.02.53.03.54.0 gain (db) frequency (ghz) de-embedded gain gain (db) de-embedded s-parameter vcc = 5v 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0 . 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 s11 swp max 6ghz swp min 0.01ghz s(1,1) 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0 . 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 s22 swp max 6ghz swp min 0.01ghz s(2,2) s-parameter data v dd = +5 v, i cq = 50 ma, t = +25 c, unmatched 50 ohm system, calibrated to device leads freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -10.60 -165.03 18.97 169.37 -28.21 3.31 -20.93 -16.62 100 -9.49 175.55 18.25 174.21 -28.93 7.02 -18.17 -16.66 200 -10.87 147.24 19.40 177.58 -27.58 15.94 -20.08 -53.04 400 -17.37 131.91 20.53 160.55 -26.03 13.26 -35.69 161.57 800 -19.08 -162.95 19.71 130.50 -25.55 10.38 -18.59 54.50 1000 -16.31 -155.70 18.89 118.70 -25.42 10.64 -17.17 35.91 1200 -14.56 -155.11 18.10 108.64 -25.21 11.47 -16.62 16.88 1500 -13.21 -157.04 16.88 94.87 -24.85 13.11 -15.65 -9.94 1900 -12.17 -158.41 15.32 79.10 -24.31 13.69 -14.06 -43.51 2000 -11.91 -158.36 14.97 75.77 -24.10 13.71 -13.59 -50.29 2200 -11.68 -157.13 14.26 68.76 -23.87 13.48 -12.60 -62.64 2500 -11.30 -155.40 13.24 59.49 -23.35 12.97 -11.28 -75.63 2600 -11.23 -154.34 12.92 56.53 -23.20 12.81 -10.96 -79.40 3000 -11.03 -150.07 11.67 45.14 -22.54 11.37 -9.77 -89.57 3500 -11.47 -147.07 10.53 31.94 -21.61 7.86 -9.39 -100.67 4000 -13.13 -160.94 9.56 16.71 -20.66 1.90 -10.56 -116.49 www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 4 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? application circuit configuration notes: bill of material: TQP3M9005-pcb reference desg. value description manufacturer part number u1 high linearity lna gain block triquint TQP3M9005 c2 100 pf cap, chip, 0603, 50v, npo, 5% various c6 18 pf cap, chip, 0603, 50v, npo, 5% various c1 0.1 uf cap, chip, 0603, 16v, x7r, 10% various l2 33 nh ind, chip, 0603, 5% various c3 4.7 uf cap, chip, 0603, 6.3v, x5r, 20% various b1 0 ? res, chip, 0603, 1/16w, 5% various l1, d1, c4 do not place various 1. see pc board layout, under applications information. 2. components shown on the silkscreen but not on the schematic are not used. 3. b1 (0 ? jumper) may be replaced with copper trace in the target application layout. 4. all components are of 0603 size unl ess stated on the schematic. 5. c6 and l2 value are critical for linearity performance. www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 5 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? typical performance TQP3M9005-pcb test conditions unless otherwise noted: +25oc, +5v, 50 ma, 50 ? system. the data shown belo w is measured on TQP3M9005-pcb notes: 1. oip3 measured with two tones at an output power of +2 dbm / t one separated by 1 mhz. the suppr ession on the largest im3 product is used to calculate the oip3 using 2:1 rule. 2. noise figure data shown in the table above is measured on evaluation board and corrected for the board loss of 0.11 db @ 0.5 gh z, board loss of 0.08db @ 0.9 ghz, board loss of 0.13db @ 1.9 ghz, board lo ss of 0.14db @ 2.1 ghz and board loss of 0.17db @ 2.6 ghz. performance plots performance plots data is measured using TQP3M9005-pcb. noise figure plot has been corrected for evaluation board loss of around 0.13db @ 1.9 ghz. 6 8 10 12 14 16 18 20 22 24 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 gain (db) frequency (ghz) gain vs. frequency +85 c +25 c ? 40 c vcc = 5v -25 -20 -15 -10 -5 0 0.00.51.01.52.02.53.03.54.0 input return loss (db) frequency (ghz) input return loss vs. frequency +85 c +25 c ? 40 c vcc = 5v -25 -20 -15 -10 -5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 output return loss (db) frequency (ghz) output return loss vs. frequency +85 c +25 c ? 40 c vcc = 5v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.51.01.52.02.53.0 nf (db) frequency (ghz) noise figure vs. frequency vcc = 5 v +85 c +25 c ? 40 c 25 30 35 40 0246810 oip3 (dbm) output power (dbm) oip3 vs. output power/tone freq. = 900 mhz 1mhz tone spacing vcc = 5v +85 c +25 c ? 30 c ? 40 c 25 30 35 40 0246810 oip3 (dbm) output power/tone (dbm) oip3 vs. output power/tone freq. = 1900 mhz 1 mhz tone spacing vcc = 5v +85 c +25 c ? 30 c ? 40 c frequency mhz 500 900 1900 2100 2600 gain db 20.6 19.4 15.3 14.5 12.8 input return loss db 19 16 12 11 11 output return loss db 17 16 14 13 11 output p1db dbm +22.2 +22.2 +22.3 +22.5 +22.5 oip3 [1] dbm +32 +32.9 +34.0 +33.6 +33.8 noise figure [2] db 1.0 0.9 0.8 0.85 1.1 www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 6 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? performance plots 25 30 35 40 0.5 1.0 1.5 2.0 2.5 oip3 (dbm) frequency (ghz) oip3 vs. frequency 1 mhz tone spacing temp. = 25 o c vcc = 5v 20 21 22 23 24 -40-20 0 20406080 p1db (dbm) temperature (c) p1db vs. temperature 1900 mhz 900 mhz vcc = 5v 25 30 35 40 3.0 3.3 3.5 3.8 4.0 4.3 4.5 4.8 5.0 oip3 (dbm) vdd(v) oip3 vs. vdd pout per tone = 2dbm 900mhz 1900 mhz 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.0 3.3 3.5 3.8 4.0 4.3 4.5 4.8 5.0 nf (db) vdd (v) noise figure vs. vdd 1900 mhz 900 mhz 40 42 44 46 48 50 3.0 3.3 3.5 3.8 4.0 4.3 4.5 4.8 5.0 idd (ma) vdd (v) idd vs. vdd 15 17 19 21 23 25 3.03.33.53.84.04.34.54.85.0 p1db (dbm) vdd (v) p1db vs. vdd 900mhz 1900 mhz www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 7 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? TQP3M9005 low freque ncy performance test conditions unless otherwise noted: +25oc, +5v, 50 ma, 50 ? system. performance plots 15 16 17 18 19 20 21 22 0 100 200 300 400 500 gain (db) frequency (mhz) gain vs. frequency temp. = +25 c -30 -25 -20 -15 -10 -5 0 0 100 200 300 400 500 s11 (db) frequency (mhz) return loss vs. frequency s11 s22 temp. = +25 c 15 16 17 18 19 20 21 22 23 20 40 60 80 100 120 140 160 180 200 p1db (dbm) frequency (mhz) p1db vs. frequency temp. = +25 c 15 20 25 30 35 20 40 60 80 100 120 140 160 180 200 oip3 (dbm) frequency (mhz) oip3 vs. frequency temp. = +25 c 0 1 2 3 4 5 6 7 8 9 10 40 60 80 100 120 140 160 180 200 nf (db) frequency (mhz) noise figure vs. frequency temp. = +25 c frequency mhz 50 100 200 gain db 18.9 18.3 19.4 input return loss db 10 9.7 11.5 output return loss db 16 18 22 output p1db dbm +18.7 +19.45 +21.4 oip3 dbm +29.2 +29.7 +27.5 noise figure db 6.6 5.1 2.9 www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 8 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? pin description ? 7 8 6 5 14 13 15 16 12 11 10 9 1 2 3 4 backside paddle - rf/dc gnd pin 1 reference mark pin symbol description 2 rf input input, matched to 50 ohms. external dc block is required. 11 vdd / rfout output, matched to 50 ohms, external dc block is required and supply voltage. all other pins gnd these pins are not connected internally but are recommended to be grounded on the pcb for optimal isolation. gnd paddle backside paddle. multiple vias should be employed to minimize inductance and thermal resistance; see pcb mounting pattern in mechanical information section. applications information pc board layout top rf layer is .014? nelco n4000-13, ? r = 3.9, 4 total layers (0.062? thick) for mechanical rigidity. metal layers are 1-oz copper. 50 ohm microstrip line details: widt h = .029?, spacing = .035? the pad pattern shown has been developed and tested for optimized assembly at triquint semiconductor. the pcb land pattern has been developed to accommodate lead and package tolerances. since surface mount processes vary from company to company, careful process development is recommended. for further technical information, refer to www.triquint.com www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 9 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? mechanical information package information and dimensions marking: part number: 9005 year, week code: yyww assembly code: axxxx notes: 1. all dimensions are in millimeter s. angles are in degrees. pcb mounting pattern notes: 1. all dimensions are in millimeter s. angles are in degrees. 2. use 1 oz. copper minimum for top and bottom layer metal. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance 3. ground/thermal vias are required for the proper operation of this device. we recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10?). 4. ensure good package backside paddle solder attach for reliable operatio n and best electrical performance. ? top view side view bottom view 3.000.05 3.000.05 .20 ref. 0.000-0.050 pin #1 identification chamfer 0.300 x 45 1.700.05 exp.dap 0.230.05 0.50 bsc 1.50 ref. 1.700.05 exp.dap 0.850.05 pin 1 locator gnd/thermal pad 0.380.05 triquint 9005 yyww axxxx package outline 0.31 0.09 0.55 0.32 0.64 pin 1 locator component side 7x 1 16x 0.32 0.50 pitch 16x 16x 0.52 1.50 1.50 www.datasheet.net/ datasheet pdf - http://www..co.kr/
TQP3M9005 lna gain block data sheet: rev d 12/12/11 - 10 of 10- disclaimer: subject to change without notice ? 2011 triquint semiconductor, inc. connec ting the digital world to the global network ? product compliance information esd information esd rating: class 1a value: passes 250 v to < 500 v test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: passes 1000 v test: charged device model (cdm) standard: jedec standard jesd22-c101 solderability package contact plating: annealed matte tin. compatible with both lead-free (maximum 260c reflow temperature) and lead (maximum 245c reflow temperature) soldering processes. the part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating moisture sensitivity level 1 at 260c per ipc/jedec j-std- 020. contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information abou t triquint: web: www.triquint.com tel: +1.503.615.9000 email: info-sales@tqs.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@tqs.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatso ever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and th e entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any part y any patent rights, licenses, or any other intellectual prope rty rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be exp ected to cause severe pers onal injury or death. www.datasheet.net/ datasheet pdf - http://www..co.kr/
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